Whether metals or ceramics – our cutting systems have a wide range of parameters to be able to cut many different materials.
Parts made of polyimide are cut without discoloration of the edges, even if they contain holes with a diameter of less than 1 mm.
This filigree cut into a 0.375 thin silicon wafer places high demands on the laser cutting system.
PCB substrate materials cause problems with laser cutting because the cut surface tends to carbonize and can thereby create conductive connections. Our cutting system developed for this purpose produces good quality cut surfaces.
Filigree cuts in a 0.5 mm thick glass plate.
Cutting electrode sheets for the production of Li-ion battery cells.
